Structure Name | Pocket Type | Stack Type | Multiple Type | Cool Post Type |
Drawing | ||||
Description | The IC is covered by the coil. | The IC is stacked on the coil. | The IC and coil are placed side-by-side. | The molded IC is stacked under the coil. |
Features * | ◎ Radiated noise ◎ Near magnetics field △ Cost ◎ Mounting area ○ Large current ○ Heat dissipation | ○ Radiated noise △ Near magnetics field ◎ Cost ○ Mounting area △ Large current △ Heat dissipation | ○ Radiated noise ○ Near magnetics field ○ Cost △ Mounting area ◎ Large current ◎ Heat dissipation | ○ Radiated noise ○ Near magnetics field ○ Cost ○ Mounting area ○ Large current ◎ Heat dissipation |
Products | XCL100/XCL101 (step-up) XCL102/XCL103 (step-up) XCL201/XCL202 (step-down) XCL205/XCL206 (step-down) XCL210(step-down) XCL232(step-down) XCL233(step-down) | XCL208/XCL209 (step-down) | XCL211/XCL212 (step-down) | XCL104/XCL105 (step-up) |