1
题目:Modeling Solid-state Diffusion bonding
作者:A.Hill,E.R.Wallach
期刊:Acta Metallurgica,Volume 37, Issue 9, September 1989, Pages 2425-2437
年:1989
2
题目:Modeling of viscoplastic adhering process by a finite element technique
作者:Y.Takahashi, T,Koguchi, K.Nishiguchi
期刊:Journal of Engineering Materials and Technology.1993,115(1):150-155
年:1993
等待中