大家帮个忙。这两篇会议文献,只能查到摘要。那位大哥能否帮小弟找到全文?谢谢了
【序号】:1
【作者】:T. Ko,A. Radisic, S. Armini, P. M. Vereecken, C.Drijbooms,H. Bender, S. P. Sun,C. Wann,C. H. Yu,
P. Leunissen, W. Ruythooren,and S. Vanhaelemeersch
【题名】:The Role of Additives and Deposition Parameters in Cu Plating of High Aspect Ratio Vias
【期刊】:216th ECS Meetin,MA2009-02, October 4 - October 9, 2009 , Vienna, Austria
【年、卷、期、起止页码】:Abstract 2179
【全文链接】:http://scitation.aip.org/getabs/servlet/GetabsServlet?prog=normal&id=MAECES000902000026002179000001&idtype=cvips&gifs=yes
【序号】:2
【作者】:A. Radisic,O. Lühn,Jan Vaes, S. Armini, Z. El-Mekki, D. Radisic, W. Ruythooren, and P. M.
Vereecken
【题名】:Copper Plating for 3D Interconnects
【期刊】:216th ECS Meetin,MA2009-02, October 4 - October 9, 2009 , Vienna, Austria
【年、卷、期、起止页码】:Abstract 2178
【全文链接】:http://scitation.aip.org/getabs/servlet/GetabsServlet?prog=normal&id=MAECES000902000026002178000001&idtype=cvips&gifs=yes