【序号】:1
【作者】John P. Healy,
Derek Pletcher【题名】:The chemistry of the additives in an acid copper electroplating bath: Part I. Polyethylene glycol and chloride ion
【期刊】:Journal of Electroanalytical Chemistry
【年、卷、期、起止页码】:Volume 338, Issues 1–2, October 1992, Pages 179–187
【连接】:http://www.sciencedirect.com/science/article/pii/0022072892804209
【序号】:2【作者】
John P. Healy;
Derek Pletcher;
Mark Goodenough 【题名】:The chemistry of the additives in an acid copper electroplating bath: Part II. The instability 4,5-dithiaoctane-1,8-disulphonic acid in the bath on open circuit【期刊】:Journal of Electroanalytical Chemistry
【年、卷、期、起止页码】:(October 1992), 338 (1-2), pg. 167-177
【连接】:http://www.sciencedirect.com/science/article/pii/002207289280421Y
【序号】:3【作者】
John P. Healy;
Derek Pletcher;
Mark Goodenough 【题名】:The chemistry of the additives in an acid copper electroplating bath: Part III. The mechanism of brightening by 4,5-dithia-octane-1, 8-disulphonic acid
【期刊】:Journal of Electroanalytical Chemistry
【年、卷、期、起止页码】:Volume 338, Issues 1–2, October 1992, Pages 179–187
【连接】:http://www.sciencedirect.com/science/article/pii/002207289280422Z