【序号】:1
【作者】:Hong-Ching Lin,Pang Lin,Chun-An Lu,Sea-Fue Wang【题名】:Effects of silver oxalate additions on the physical characteristics of low-temperature-curing MOD silver paste for thick-film applications
【期刊】:Microelectronic Engineering
【年、卷、期、起止页码】:Volume 86, Issue 11, November 2009, Pages 2316–2319
【全文链接】:http://www.sciencedirect.com/science/article/pii/S0167931709003463
【序号】:2
【作者】:E. Ide,S. Angata, A. Hirose, K.F. Kobayashi【题名】:Metal–metal bonding process using Ag metallo-organic nanoparticles【期刊】:Acta Materialia【年、卷、期、起止页码】:Volume 53, Issue 8, May 2005, Pages 2385–2393【全文链接】:http://www.sciencedirect.com/science/article/pii/S1359645405000753