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原文由 unht(unht) 发表:
These applications include:
– measurement of bending of parts in MEMS such as cantilever beams or contactors in printed circuit
boards,
– bending of bond pads,
– measurement of Poisson’s ratio via four point bending and the anticlastic curvature method,
– membrane deformation,
– in-situ observation of deformation field during indentation,
– in-situ through-the-sample observation of deformation and crack formation during scratching on transparent materials.
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