主题:RoHS 6项新豁免项通过TAC投票(请版主置顶)

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pm1011
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在今年6月26日的TAC会议中,欧盟成员国投票赞成六项新的RoHS豁免提议项,其中包括印刷墨水中的铅和镉,连接器以外细节距元器件中的铅,特殊电容器焊料中的铅,某些显示器和灯具中的铅氧化物,特殊传感设备中作为焊料的铅合金。对于有在产品中利用以上技术的厂商,比如,等离子显示器厂商,以上豁免技术的采用是非常有利的。

这些豁免项将在下次TAC会议正式采纳后正式公布出来。

被提议的豁免项具体如下:

21 Lead and cadmium in printing inks for the application of enamels on borosilicate glass.     
23 Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with NiFe lead frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with copper lead-frames. 
24 Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors 
25 Lead oxide in plasma display panels(PDP)and surface conduction electron emitter displays(SED) used in structural elements; notably in the front and rear glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the  seal frit and frit ring as well as in print pastes. 
26 Lead oxide in the glass envelope of Black Light Blue(BLB)lamps. 
27 Lead alloys as solder for transducers used in high-powered(designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers."
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pm1011
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兄弟,这个资料太旧了,希望以后能够加强相关消息的关注,论坛中已经有相应指令2006/310/EC的下载
pm1011
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原文由 lotus_sum 发表:
兄弟,这个资料太旧了,希望以后能够加强相关消息的关注,论坛中已经有相应指令2006/310/EC的下载


版主这回错了,2006/310/EC 也是我最先发布的,豁免条款为第16-20条。以上条款尚未最后通过!!
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lsyzsdx
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原文由 pm1011 发表:
在今年6月26日的TAC会议中,欧盟成员国投票赞成六项新的RoHS豁免提议项,其中包括印刷墨水中的铅和镉,连接器以外细节距元器件中的铅,特殊电容器焊料中的铅,某些显示器和灯具中的铅氧化物,特殊传感设备中作为焊料的铅合金。对于有在产品中利用以上技术的厂商,比如,等离子显示器厂商,以上豁免技术的采用是非常有利的。

这些豁免项将在下次TAC会议正式采纳后正式公布出来。

被提议的豁免项具体如下:

21 Lead and cadmium in printing inks for the application of enamels on borosilicate glass.     
23 Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with NiFe lead frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with copper lead-frames. 
24 Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors 
25 Lead oxide in plasma display panels(PDP)and surface conduction electron emitter displays(SED) used in structural elements; notably in the front and rear glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the  seal frit and frit ring as well as in print pastes. 
26 Lead oxide in the glass envelope of Black Light Blue(BLB)lamps. 
27 Lead alloys as solder for transducers used in high-powered(designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers."

21、用于硼硅酸盐玻璃瓷漆的印墨所含的铅及镉。
22、于光纤通讯系统稀土铁石榴石法拉第旋转器中作为杂质的铅。
23、小螺距零部件面料所含的铅。
24、通孔盘状及平面阵列陶瓷多层电容器焊料所含的铅。
25、等离子显示屏(PDP)及表面传导式电子发射显示器(SED)的构件所用的氧化铅。
26、蓝黑灯管(BLB)玻璃外罩所含的氧化铅。
27、在大功率扬声器中作为转换器焊料的铅合金。
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